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          2. 3D NAND

            The growing demands of mobile computing and data centers continue to drive the need for high-capacity, high-performance NAND flash technology. With planar NAND nearing its practical scaling limits, delivering to those requirements has become more difficult with each generation. Enter our 3D NAND technology, which uses an innovative process architecture to provide 3X the capacity of planar NAND technologies while providing better performance and reliability.

            System designers who build products like laptops, mobile devices and servers can take advantage of 3D NAND’s unprecedented performance to meet the rising data movement needs for businesses and consumers.

            Density

            Select Density
            • 128Gb
            • 256Gb
            • 512Gb
            • 1Tb
            • 2Tb
            • 4Tb
            • 8Tb
            Range: 128Gb - 8Tb
            • Bits/Cell
              MLC
            • Voltage
              3.3V
            • Package
              VBGA
            • Op. Temp.
              -40C to +85C
            • Bits/Cell
              SLC, TLC
            • Voltage
              3.3V
            • Package
              Wafer, VBGA
            • Op. Temp.
              0C to +70C, -40C to +85C
            • Bits/Cell
              MLC, TLC
            • Voltage
              2.5V, 3.3V
            • Package
              Wafer, VBGA
            • Op. Temp.
              0C to +70C, -40C to +85C
            • Bits/Cell
              TLC
            • Voltage
              2.5V, 3.3V
            • Package
              VBGA
            • Op. Temp.
              0C to +70C
            • Bits/Cell
              TLC
            • Voltage
              2.5V, 3.3V
            • Package
              VBGA
            • Op. Temp.
              0C to +70C
            • Bits/Cell
              TLC
            • Voltage
              2.5V, 3.3V
            • Package
              LBGA
            • Op. Temp.
              0C to +70C
            • Bits/Cell
              TLC
            • Voltage
              3.3V
            • Package
              LBGA
            • Op. Temp.
              0C to +70C
            +
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